Multiscale atomistic simulation of oxidation, stress and diffusion processes in SiGe

SiGe alloy is being used more and more in the semi-conductor industry for nano-device fabrication, especially in thin layers (a few nanometers). The small size of those films brings to light new physical phenomena which are over the scope of traditional simulation tools. Thus, new phenomenological models are needed in order to progress towards miniaturization.

The goal of this project is to supply the technology engineers with the appropriate numerical models so that they will be able to control the manufacturing steps concerned with the oxidation, the implantation, or the thermal annealing of these SiGe nano-devices. These models will be designed using state-of-art atomistic simulation tools (ab initio calculation, molecular dynamics and kinetic Monte Carlo simulations) and will be checked by comparison with experimental results. The implementation of these models in industrial simulation tools will be the final step of the project.

Contributors

The project is based on 5 contributors:


Fifth meeting

Marseille (April 20-21th, 2009)

the OSiGe_Sim group

Fourth meeting

Carcassonne (September 8-9th 2008)

the MMNT

Third meeting

Grenoble (December 5-6th 2007)

the MMNT

Poster at J3N

Paris (Septembre 25-27th 2007)

Second meeting

Marseille (April 26-27th, 2007)

the OSiGe_Sim group

Poster at J3N

Besançon (November 6-8th, 2006)

First meeting

St Bertrand de Comminges (September 26-27th, 2006)

OSiGe_Sim

Kick-off meeting

Col de Porte (January 18th, 2006)

OSiGe_Sim